In order to avoid losses due to fakes and substandard products in the semiconductor market and to ensure the authority and reliability of the products used, we work with third-party authoritative testing institutes and offer testing services for the following semiconductors.
Open-cap testing: Open-cap testing is a destructive method of testing and analysis. Removing the external package of the chip (usually silicon) to examine the wafer code and the internal condition of the chip.
Programming testing: mainly tests memory chips and other memory chips, especially one-time programming (OTP) devices. Performing erasure, blanking tests, burn-in analysis calculations and confirming SUM values.
Electrical performance testing: testing of pin-to-pin electrical parameters such as current, voltage, resistance, silicon connectivity, etc. The trace curve test is of high value and authority in defect analysis and reliability projects. This test makes it easy to identify the authenticity of the chip and whether it has been damaged by ESD/MSL. The chip is tested to generate a certain number of rounds of trace curves, and a qualified chip will show an identical graph or a graph within the error range allowed by the product data.
Critical function testing: Simulate a specific application environment platform to test if each function can be achieved, power up the test equipment to drive the chip and simulate the working environment on the PCB to test the key functions of the chip.